钻井井架力学性能分析

钻井井架作为钻机系统设备中的关键部分,其力学性能直接关系到整套钻机系统的安全生产。文章推导了常用于分析钻井井架力学性能的理论,即线性屈曲、几何非线性和双重非线性理论。提出同时用这三种理论对钻井井架进行综合比较分析,从而合理地预见井架力学性能的方法。以A形钻井井架为例,进行了详细的分析,得到了井架的失稳形式、极限承载、破坏特征及薄弱部位,为钻井井架的设计、优化与评定提供了参考。     

脉冲电镀的正向电流密度对深镀能力的影响

主要通过在正反向电流比、频率、脉冲宽度一定的条件下,改变正向电流密度的大小来研究其对PCB整板电镀铜深镀能力的影响。从测得的数据可知随着正向电流密度的增大,深镀能力先变大后变小,并对这个问题进行了理论分析。     

高厚径比盲孔电镀

盲孔能够大大的增加板的密度,从而减小板面积。介绍了有关高厚径比盲孔电镀的有关工艺,从激光钻孔、金属化孔和电镀几个方面对孔径4mil以上的盲孔电镀进行了研究。     

Na_2O－Al_2O_3－SiO_2系统霞石微晶玻璃机械强度的研究

霞石微晶玻璃是一种高强度的新型无机非金属材料．本文以Ｎａ２Ｏ－Ａｌ２Ｏ３－ＳｉＯ２系统为基础，引入晶核剂和复合澄清剂，经高温熔制和两步热处理制备的霞石微晶玻璃，具有较高的抗压和抗折强度．结果表明，霞石微晶玻璃的机械强度与霞石晶体及试样的结构有关，也与微晶化热处理的时间有关。     

氧化铈对改善ZTM陶瓷性能的作用

工业用电熔莫来石原料中含有钾、钠等杂质，而化学法制备的高纯莫来石中这些杂质含氏，因而以氧化锆增韧这两种莫来石制备陶瓷，发现其力学性能温度的变化趋势有较大差异。后者随温度升高力学性能反而有所增长。研究发现这一变化与原料中杂质含量有关。     

Al2O3/TiB2/SiCw三元复合材料的力学性能及显微结构

以Al₂O₃为基体,SiC晶须和TiB₂颗粒两种增韧剂,采用热压烧结工艺制备了Al₂O₃/TiB₂/SiC_w三元复合陶瓷材料。研究了热压工艺参数对材料致密度的影响和晶须含量对该复合材料的力学性能和显微结构的影响。结果表明;随晶须含量的增加,该复合材料的热压温度和保温时间需要相应的增加;晶须拔出、裂纹偏转和晶须的桥接为该复合材料的主要增韧机理;随晶须含量的增加,该材料的室温断裂韧性增加;该材料的断裂韧性随温度的升高而呈增大趋势,并且晶须含量越高,材料的高温断裂韧性增幅越大。     

氢对2.25Cr-1Mo压力容器用钢力学性能影响

基于试样高温高压釜充氢方法 ,研究了氢对 2 2 5Cr 1Mo压力容器用钢力学性能的影响。对充氢前后的试样进行了拉伸和CVN冲击试验 ,结果表明 ,氢对 2 2 5Cr 1Mo钢的拉伸力学性能和冲击韧性影响不显著。     

Pultruded fibre reinforced polyurethane composites II. Effect of processing parameters on mechanical and thermal properties

This paper presents a novel process for the fabrication of pultruded polyurethane (PU) composites. The effects of the processing parameters on the mechanical properties (flexural strength and flexural modulus, etc.) and thermal properties (HDT) of the fibre reinforced PU composites by pultrusion have been studied. The processing parameters investigated include pulling rate (in-line speed), die temperature, filler type and content, and post-cure time and temperature. Results show that the composites possessed various optimum pulling rates at different die temperatures. On the basis of the DSC diagram, the swelling ratio, the mechanical properties and the thermal properties of composites, the optimum die temperature can be determined. It is found that the mechanical and thermal properties increase with filler content for various types of filler. The mechanical and thermal properties increase at a suitable post-cure temperature and time. Furthermore, the properties which decreased due to the degradation of composite materials for a long post-cure time will be discussed.     

压缩式封隔器胶筒变形阶段力学分析

封隔器是常用试采井下工具,胶筒是封隔器中最重要的部件。将压缩式胶筒的变形分为自由变形和约束变形2个阶段,分析了其绝对体积变化规律,得到了使胶筒刚好与井壁接触的轴向力,据此可以确定最小坐封载荷;得到了井壁和中心管对胶筒的约束压力,在此基础上得到了压缩式胶筒的各个应力分量和第四相当应力,据此可以给出坐封力下胶筒的强度,确定合理的坐封力。实例计算解释了现场封隔器胶筒在坐封载荷作用下损坏的原因。     

Effect of chloride ions on immersion plating of copper onto porous silicon from a methanol solution

The effect of chloride ions (Cl⁻) during the immersion plating of copper onto porous silicon (PS) from a methanol (MeOH) solution has been studied. The presence of Cl⁻ in the Cu²⁺ solution was found to slow down the rate of copper deposition, as confirmed by inductively coupled argon plasma emission spectroscopy and X-ray photoelectron spectroscopy measurements. The threshold concentration of Cl⁻ at which the deposition of copper is very severely diminished was found to be 0.1 M. The inhibition effect is discussed on the basis of the rest potential values of PS and polarization curve measurements. They revealed that the rest potential of PS upon dipping in these solutions appears to direct the metal deposition. Current density-potential curves show that at Cl⁻ concentrations higher than 0.1 M, the reduction of Cu ions proceeds in two steps; the reduction of Cu(II) to Cu(I) followed by the reduction of Cu(I) to Cu(0). This suggests that Cu(I) species in MeOH solution can be stable over a certain potential range and this stability of Cu(I) is responsible for the inhibition of metal deposition. Fourier transform infrared spectroscopy and scanning electron microscopy (SEM) were also performed to investigate the structural changes and characterizations of PS samples after the plating process.